INTEGRATED CIRCUIT PACKAGE Russian patent published in 1995 - IPC

FIELD: radio engineering. SUBSTANCE: strip leads of package have different width. Wider leads are intended for grounding and are connected directly to base of package. Narrow potential leads are meant for installation on printed circuit board and are central conductors of pressure-sealed feed-through and form three-wire line. They are matched to standard wave resistance, pass through holes of spacer and are positioned between wide leads at equal distance from each other. EFFECT: expanded application field, facilitated manufacture. 2 dwg