MICROWAVE INTEGRATED-CIRCUIT CASE Russian patent published in 1997 - IPC

FIELD: electronic engineering. SUBSTANCE: microwave integrated-circuit case has metal base 5; dielectric plate 1 located on base 5 with its one side with external leads, with microstrip lines 2 on its opposite side on the periphery, which are electrically connected to external leads by means of through metal conductors 3 in dielectric plate 1; microwave integrated circuit 4 positioned on dielectric plate 1 and electrically connected to its microstrip lines 2; and case cover 6 hermetically connected around the edges to dielectric plate 1. Hole 2 is available in the center of plate 1. Cross-sectional diameter of through metal conductors 3 of dielectric plate 1 is within 0.1 to 1.0 of the width of microstrip line 2 of dielectric plate 1. Metal base 5 of the case is located in the same plane with the external leads. Base 5 is 0.03 to 1.5 mm thick and can overlap hole 7 of dielectric plate 1, whose diameter is within 0.1 to 1.5 mm. Base 5 is hermetically connected to dielectric plate 1; the microwave integrated circuit is located in hole 7 of dielectric plate 1 in a spaced relation, the gap between it and the hole walls not exceeding 250 um, flush with the surface of dielectric plate 1 with microstrip lines 2 for thermal contact with case base 5. EFFECT: improved design. 7 cl, 3 dwg