FIELD: special coating compositions. SUBSTANCE: adhesion composition has, mas. p. butadiene nitrile rubber 100; mixture of novolacs and resol-formaldehyde resin at the mass ratio 2:(0.8-1) 30-50; epoxy-diane resin 50-100; hardener 4,4′-diaminodiphenylmethane or 4,4′-diaminodiphenyl ester 2-5; organic solvent 975-2578. Composition is applied on the polyimide film by continuous method and dried for 10 min at constant temperature rise up to 120 C. Properties of adhesion composition: resistance to trichloroethylene (at 60 ± 5qC is above 10 min), to melted solder action at 300 ± 5°C for 30 s, exfoliation strength from alloy is 42 H/m 387 H/m, stickiness absence. Composition is used for polyimide film gluing. EFFECT: enhanced quality of composition. 1 tbl
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Authors
Dates
1995-07-20—Published
1992-01-09—Filed