HEAT-RESISTANT ADHESIVE COMPOSITION Russian patent published in 2003 - IPC

FIELD: heat- resistant adhesive compositions possessing high strength of bonded joints at temperature of 400 C working at such temperature for 50 h; space engineering. SUBSTANCE: proposed composition includes phenolformaldehyde resin, carboxylated butadiene acrylonitrile rubber, 1.7- di(oximethyl)-m-carborane, organic solvent, oligo-methyl phenyl carborane siloxane. Used as phenol-formaldehyde resin is mixture of novolak and resol phenol- formaldehyde resins at the following relationship of components, parts by mass: (15.0-35.0) : (15.0-35.0). Composition may additionally contain filler in the amount of 100.0 to 200.0 parts by mass. EFFECT: increased service life of bonded joints; enhanced reliability of joints working at 400 C for 50 h. 5 cl, 2 tbl