COLD CURING ADHESIVE COMPOSITION Russian patent published in 2023 - IPC C09J163/02 C09J163/04 C08K5/544 

FIELD: adhesives.

SUBSTANCE: invention can be used when connecting heat-shrinkable elements. Cold curing adhesive composition includes epoxy resin, low molecular weight rubber, oligoamide hardener, curing accelerator, mixture of polyethylene and polyamide powder, mineral filler and carbon black. Tris-2,4,6-(dimethylaminomethyl)phenol and a mixture of the reaction product of diethylaminomethyltriethoxysilane with 1-aminohexamethylene-6-aminomethylenetriethoxysilane are used as a curing accelerator. The epoxy resin is a mixture of epoxy diano resin with one or more epoxy resins selected from 3,3-diethyl-4,4-diaminodiphenylmethane tetraglycidyl ether, N,N polyglycidyl derivative of a low molecular weight phenol-formaldehyde novolak. Low molecular weight rubber is a carboxylated nitrile butadiene rubber or its mixture with a low molecular weight copolymer of butadiene and acrylic acid nitrile with terminal chlorobenzyl groups.

EFFECT: invention makes it possible to increase the strength of adhesive joints while maintaining the ability of the adhesive composition to withstand short-term heating without curing.

2 cl, 2 tbl, 6 ex