FIELD: soldering. SUBSTANCE: solder contains (in wt %): chromium, 0.01-21; iron, 0.01-4; boron, 0.01-16; silicon, 0.01-19; phosphorus, 0.01-22; one or several components selected from the group: Sn, Ga, In, Bi, Pb, Cd, Zn, 0.01-0.5. Summary percentage of boron, silicon, and phosphorus ranges from 16 to 24%. It is advantageous that at least 50% of structure of solder were amorphous. EFFECT: improved quality of solder. 2 cl, 1 tbl
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Authors
Dates
1997-11-20—Published
1993-04-13—Filed