COMPOUND FOR GLUES AND COMPOSITION MATERIALS Russian patent published in 1995 - IPC

FIELD: glues. SUBSTANCE: compound has, mas. p. epoxy resin 100; filler 20-2500; carboran-containing polyethylenepolyamine 7.1-54.2. Compound can contain additionally modifying addition - derivatives of carboran of the general formula R₁CB₁₀H₁₀CR₂ where R₁ and R₂ are similar or different organic substituents, and R₁ H, alkyl, aryl, alkenyl, simple ether or ester, acid; R₂ alkyl, aryl, alkenyl, simple ether or ester, acid at concentration 0.06-100.0 mas. p. per 100 mas. p. epoxy resin, and also oligoamide a product of condensation of flax, tall or soybean oil dimerized acids with diethylenetriamine, triethylenetetramine or tetraethylenepentamine at concentration 6.6-95.0 mas. p. per 100 mas. p. epoxy resin. Compound is low toxic, its working temperature is up to 450 C, it tolerates up to 600 C, shows strength at glue seam shift up to 28.0 MPa, at rupture up to 60 MPa, at compression up to 130.0 MPa. Compound is used for preparing universal and specialized thermostable glue. EFFECT: enhanced quality of glue. 3 cl, 2 tbl