HEAT RESISTANT GLUE COMPOSITION OF COLD HARDENING Russian patent published in 2009 - IPC C09J163/00 

FIELD: construction.

SUBSTANCE: composition includes the following components, wt parts: epoxy silicon organic resin - 100, mixture of isomers γ and β-aminopropyltrietoxysilane - 30-45, tris -[2,4,6-(dimethylaminomethyl) phenol] - 1-3, product of interaction of bis-o-cianamines with tetranitrils of aromatic tetracarbon acids -120-160.

EFFECT: produced glue composition has high strength in process of glue joints shift at high temperatures 300°-450°C, with preservation of initial strength of glue joints.

1 cl, 2 tbl, 1 ex