FIELD: soldering. SUBSTANCE: flux contains, wt.-%: mixture of difficultly water-soluble mono- and dibasic C4-C10-carboxylic acids, 3.5-6.0; natural or synthetic resin, up to 5.0; benzotriazol, 0.1-0.5; monoatomic alcohol or mixture thereof with ethylacetate or triacetyn, the balance. Flux may be supplemented with polyoxyethylated esters of lauric and oleic acids with average molecular weight 596 and 503, respectively, or polyoxyethylated fatty C10-C18-alcohols with molecular weight 1000, up to 0.25. EFFECT: simplified soldering procedure. 2 cl, 1 tbl
Title | Year | Author | Number |
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FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
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FLUX FOR LOW-TEMPERATURE SOLDERING WITH SOLDER WAVE | 0 |
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PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
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SOLDER PASTE | 2010 |
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FLUX FOR LOW-TEMPERATURE SOLDERING OF RADIO AND ELECTRONIC EQUIPMENT COMPONENTS | 1993 |
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FLUX FOR LOW TEMPERATURE SOLDERING | 2009 |
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RU2400340C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
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SU1551503A1 |
Authors
Dates
1997-11-20—Published
1993-08-17—Filed