FIELD: electrical engineering. SUBSTANCE: insulation compound includes, per cent by mass: oligoepoxy of epichlorine hydrine and di-phenifol propane 15.44-18.60; malein anhydride 7.25-8.74; oligo-ether acrylate 5.15-8.36; dimethyl aniline 0.15-0.20; aluminium oxide 66.9-69.44. Mixture is cured at temperature 70-75 C under pressure 0.5-0.55 MPa for the course of 16 h. EFFECT: tensile strength 48-53 MPa, compression strength 210-220 MPa, electric strength 21-25 MV.m21-25 МВ·m-1.. 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTRICAL EMBEDMENT COMPOUND | 2008 |
|
RU2356116C1 |
| INSULATION COMPOUND | 1992 |
|
RU2016015C1 |
| ELECTRICALLY INSULATING COMPOSITION | 0 |
|
SU681079A1 |
| LOUDSPEAKER DIFFUSER FROM COMPOSITE MATERIAL | 2011 |
|
RU2453071C1 |
| ELECTRIC INSULATING FILLING-IMPREGNATING COMPOUND | 2017 |
|
RU2672094C1 |
| ELECTRICAL INSULATING PILLING AND IMPREGNATION COMPOUND | 2022 |
|
RU2787124C1 |
| MODIFIED ELECTROINSULATING EPOXY COMPOUND | 1997 |
|
RU2131895C1 |
| PHOTOPOLYMERIZING COMPOSITION | 1992 |
|
RU2037171C1 |
| SELF-EXTINGUISHING COMPOUND | 1992 |
|
RU2041895C1 |
| THERMOSETTING COMPOSITION | 0 |
|
SU789547A1 |
