FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electrical engineering, in particular to epoxy low-viscosity filling and impregnating compounds used for electrical insulation and hardening by pouring high-voltage power supplies, transformers, for sealing and protecting elements of electronic equipment from mechanical influences. Electrically insulating filling-impregnating compound includes an epoxidane resin, a plasticizer-diluent, oligoether acrylate, hardener, meta-phenylenediamine, contains the active diluent of monoglycidyl ester of butyl cellosolve Laproxide 301B with the following ratio of components, mass parts: epoxy resin ED-22: 100, oligoester acrylate MGF-9: 25; amine type hardener meta-phenylenediamine: 25; monoglycidyl ester of butyl cellosolve Laproxide 301B: 25.
EFFECT: invention makes it possible to improve the technological properties of the compound during its processing, id est to lower the initial viscosity of the compound and to increase its viability.
1 cl
| Title | Year | Author | Number |
|---|---|---|---|
| ELECTRICAL INSULATING PILLING AND IMPREGNATION COMPOUND | 2022 |
|
RU2787124C1 |
| HIGHLY FILLED COMPOUND FOR THE FERROMAGNETIC CORES MANUFACTURING | 2017 |
|
RU2680999C1 |
| POLYMER SEALING COMPOUND | 2021 |
|
RU2782806C1 |
| ELECTRICAL EMBEDMENT COMPOUND | 2007 |
|
RU2343577C1 |
| ELECTRICAL EMBEDMENT COMPOUND | 2008 |
|
RU2356116C1 |
| COLD SETTING COMPOUND | 2012 |
|
RU2481373C1 |
| ELECTRIC INSULATING FILLING COMPOUND | 2011 |
|
RU2459300C1 |
| THERMAL CONDUCTING DIELECTRIC COMPOUND | 2017 |
|
RU2650818C1 |
| INSULATING COMPOUND | 0 |
|
SU1756942A1 |
| COMPOUND AND METHOD OF IT'S PRODUCTION | 2011 |
|
RU2474599C2 |
