FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electrical engineering, in particular to epoxy low-viscosity potting and impregnating compounds used for electrical insulation and hardening by pouring high-voltage power supplies, transformers, for sealing and protecting elements of electronic equipment from mechanical stress. Electrical insulating potting and impregnating compound includes epoxy resin ED-22, active diluent butyl cellosolve monoglycidyl ether Laproxide 301B, polyoxypropyleneamine Jeffamine D-230 hardener. The ratio of components, parts by weight: epoxy resin ED-22: 100; hardener polyoxypropyleneamine Jeffamine D-230: 38.7; butyl cellosolve monoglycidyl ether Laproxide 301B: 20.
EFFECT: invention makes it possible to improve the technological properties of the compound during its processing, i.e. the value of the processing temperature of the compound decreases, the initial viscosity of the compound decreases and its viability increases.
1 cl, 1 dwg
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Authors
Dates
2022-12-28—Published
2022-08-29—Filed