FIELD: electrical engineering. SUBSTANCE: proposed compound contains, mass parts: epoxy diane resin 90-110, vinylglycidyl ether of ethylene glycol 10-20, polyethylene polyamine 10-20, organic solvent 5-15. Epoxy resin is mixed with organic solvent and sustained at least within 1 h. Then vinylglycidyl ether of polyethylene glycol is added, polyethylene polyamine is added when thoroughly mixing is carried out. Thus prepared mixture is evacuated at pressure 0.6-1.3 kPa and 25 ± 10 C till active liberation of bubbles finishes. Insulation compound is hardened at the same temperature as mentioned above within at least 24 h. Electric strength of insulation compound is 25-30 kV/mm, its viscosity is 30-45 s, working life at 20 C is 1.5-2.5 h. EFFECT: improves desired product quality. 2 tbl
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Authors
Dates
1994-07-15—Published
1992-07-23—Filed