ELECTRICAL EMBEDMENT COMPOUND Russian patent published in 2009 - IPC H01B3/40 

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

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