FIELD: soldering of electronic products. SUBSTANCE: flux contains, by weight: tin 23-25; nickel 4-6; sodium tetraborate 0.4-0.6; manganese 0.4-0.6; molybdenum 0.4-0.6; tungsten 0.4-0.6; copper the balance. EFFECT: increased efficiency and improved quality of soldering. 1 tbl
Title | Year | Author | Number |
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SOLDER FOR SOLDERING TECHNICAL ELECTRONIC PRODUCTS | 1993 |
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SOLDER FOR SOLDERING ELECTRONIC ARTICLES | 1993 |
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SOLDER FOR BRAZING PRODUCTS OF ELECTRONIC INDUSTRY | 1991 |
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HARD SOLDER FOR IRON-COBALT ALLOYS | 0 |
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NICKEL-BASED SOLDER TO MANUFACTURE STRUCTURE OF BLISK TYPE | 2014 |
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NICKEL BASE SOLDER | 2003 |
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Authors
Dates
1995-12-10—Published
1993-07-09—Filed