FIELD: soldering of electronic products. SUBSTANCE: flux contains, by weight: tin 23-25; nickel 4-6; sodium tetraborate 0.4-0.6; manganese 0.4-0.6; molybdenum 0.4-0.6; tungsten 0.4-0.6; copper the balance. EFFECT: increased efficiency and improved quality of soldering. 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDER FOR SOLDERING TECHNICAL ELECTRONIC PRODUCTS | 1993 |
|
RU2051017C1 |
| SOLDER FOR SOLDERING ELECTRONIC ARTICLES | 1993 |
|
RU2047449C1 |
| SOLDER FOR BRAZING PRODUCTS OF ELECTRONIC INDUSTRY | 1991 |
|
RU2011497C1 |
| NICKEL BASED ALLOY FOR CORROSION PROTECTION | 1990 |
|
RU1782056C |
| HARD SOLDER FOR IRON-COBALT ALLOYS | 0 |
|
SU1673351A1 |
| SOLDER FOR BRAZING CAST IRON | 0 |
|
SU1461609A1 |
| SOLDER FOR HIGH-TEMPERATURE SOLDERING | 1991 |
|
RU1793619C |
| NICKEL-BASED SOLDER TO MANUFACTURE STRUCTURE OF BLISK TYPE | 2014 |
|
RU2560483C1 |
| SOLDER FOR BRAZING COPPER, NICKEL AND ALLOYS THEREOF | 0 |
|
SU1551502A1 |
| NICKEL BASE SOLDER | 2003 |
|
RU2254972C1 |
Authors
Dates
1995-12-10—Published
1993-07-09—Filed