FIELD: soldering of electronic technical articles. SUBSTANCE: solder contains (mass): tin (19-21); nickel (4-6); molybdenum -(0.4-0.6); manganese -(0.3-0.7); borax (0.4-0.6), copper the balance. The solder allows to increase a strength of soldered joints by 5-6 times, namely joints at soldering leads of integrated circuits, made of a special alloy, with metal-loaded ceramic. EFFECT: enhanced strength of soldered joints. 1 cl, 1 tbl
Title | Year | Author | Number |
---|---|---|---|
FLUX FOR SOLDERING ELECTRONIC PRODUCTS | 1993 |
|
RU2049635C1 |
SOLDER FOR SOLDERING ELECTRONIC ARTICLES | 1993 |
|
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SOLDER FOR BRAZING PRODUCTS OF ELECTRONIC INDUSTRY | 1991 |
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RU2011497C1 |
NICKEL BASED ALLOY FOR CORROSION PROTECTION | 1990 |
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RU1782056C |
SOLDER | 0 |
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SOLDER METAL FOR SOLDERING | 2008 |
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LEAD BASED SOLDER | 2013 |
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COPPER-BASE SOLDER | 2004 |
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Authors
Dates
1995-12-27—Published
1993-02-01—Filed