SOLDER FOR SOLDERING TECHNICAL ELECTRONIC PRODUCTS Russian patent published in 1995 - IPC

Abstract RU 2051017 C1

FIELD: soldering of electronic technical articles. SUBSTANCE: solder contains (mass): tin (19-21); nickel (4-6); molybdenum -(0.4-0.6); manganese -(0.3-0.7); borax (0.4-0.6), copper the balance. The solder allows to increase a strength of soldered joints by 5-6 times, namely joints at soldering leads of integrated circuits, made of a special alloy, with metal-loaded ceramic. EFFECT: enhanced strength of soldered joints. 1 cl, 1 tbl

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RU 2 051 017 C1

Authors

Ponomarev V.A.

Dates

1995-12-27Published

1993-02-01Filed