FIELD: soldering of electronic technical articles. SUBSTANCE: solder contains (mass): tin (19-21); nickel (4-6); molybdenum -(0.4-0.6); manganese -(0.3-0.7); borax (0.4-0.6), copper the balance. The solder allows to increase a strength of soldered joints by 5-6 times, namely joints at soldering leads of integrated circuits, made of a special alloy, with metal-loaded ceramic. EFFECT: enhanced strength of soldered joints. 1 cl, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| FLUX FOR SOLDERING ELECTRONIC PRODUCTS | 1993 |
|
RU2049635C1 |
| SOLDER FOR SOLDERING ELECTRONIC ARTICLES | 1993 |
|
RU2047449C1 |
| SOLDER FOR BRAZING PRODUCTS OF ELECTRONIC INDUSTRY | 1991 |
|
RU2011497C1 |
| NICKEL BASED ALLOY FOR CORROSION PROTECTION | 1990 |
|
RU1782056C |
| SOLDER | 0 |
|
SU1706816A1 |
| SOLDER FOR SOLDERING CERAMICS TO CERAMICS AND CERAMICS TO METAL | 0 |
|
SU956202A1 |
| SOLDER METAL FOR SOLDERING | 2008 |
|
RU2374056C1 |
| LEAD BASED SOLDER | 2013 |
|
RU2547979C1 |
| SOLDER FOR BRAZING CAST IRON | 0 |
|
SU1461609A1 |
| COPPER-BASE SOLDER | 2004 |
|
RU2279957C1 |
Authors
Dates
1995-12-27—Published
1993-02-01—Filed