SOLDER FOR BRAZING PRODUCTS OF ELECTRONIC INDUSTRY Russian patent published in 1994 - IPC

Abstract RU 2011497 C1

FIELD: metal machining. SUBSTANCE: solder contains by mass percent; 19-21 tin, 2-3 nickel, 0.2-0.4 cobalt, 0.2-0.4 boron, 4-5 lead, 0.2-0.4 lithium carbonate, 0.4-0.6 iron, 0.1-0.3 manganese, and the balance copper. EFFECT: improved product quality. 1 tbl

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RU 2 011 497 C1

Authors

Ponomarev V.A.

Stadnik V.G.

Lopareva N.V.

Gureev N.V.

Dates

1994-04-30—Published

1991-06-28—Filed