SOLDER FOR SOLDERING ELECTRONIC ARTICLES Russian patent published in 1995 - IPC

Abstract RU 2047449 C1

FIELD: soldering. SUBSTANCE: solder has ingredients in by mass: tin 18-22, nickel 4-6, boron 1.2-1.8, molybdenum 0.4-0.6, manganese 0.4-0.6, sodium tetraborate 0.4-0.6, titanium 0.4-0.6. The rest is filled with copper. EFFECT: enhanced quality of connections. 1 tbl

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RU 2 047 449 C1

Authors

Ponomarev V.A.

Gureev N.V.

Antipov B.F.

Dates

1995-11-10—Published

1993-10-29—Filed