FIELD: chemical technology. SUBSTANCE: the source of parental acidic etching solution is the spent solution of printed assembling array production of the following composition, g/l: copper salt (CuCl2,CuCl) 120-200 (as copper); hydrochloric acid (HCl) 30-150, and water ((H2O)) the rest where 30% hydrogen peroxide ((H2O2)) solution is added before mixing at the ratio 30-60 ml per 1 l spent solution. The source of parental alkaline ammoniacal solution of complex copper salt is the spent alkaline etching solution of printed assembling array production containing complex copper salt [Cu(NH3)4Cl, [Cu (NH3)2]Cl at concentration 30-150 g/l (as copper) which preliminary is heated up to 40-90 C before mixing. At mixing prepared acidic solution is added to alkaline one up to pH value 3.5-6.0 in mixture. After ceasing gaseous substances liberation formed suspension is kept at 40-90 C up to attainment of copper concentration in effluent 1-2 g/l. Proposed method ensures to obtain copper oxychloride with copper content 53-56% and prevent copper ions entry and its complex chelate compounds to environment. Method is used in printed assembling array production. EFFECT: increased copper content, minimal copper content in sewage. 1 tbl
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Authors
Dates
1995-12-27—Published
1992-04-09—Filed