SOLDERING PASTE FOR OBTAINING BIMETAL JUNCTION Russian patent published in 1996 - IPC

Abstract RU 2056989 C1

FIELD: soldering. SUBSTANCE: soldering paste contains, in per cents by mass: 20-25 of nickel, 45-50 of manganese, 5-10 of cuprous chloride, and remainder is sodium silicate. EFFECT: enhanced reliability. 2 tbl

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RU 2 056 989 C1

Authors

Bondarev Ju.A.

Gonik I.L.

Dates

1996-03-27Published

1993-03-29Filed