FIELD: manufacture of precision instruments. SUBSTANCE: the process for modifying epoxy compounds by mixing compounds with dispersed cross-linked epoxy polymer in the form of microspheres with particle size of 5-1000 mcm and softening temperature at maximum vibroabsorbing power at 49-110 C and by 27-121 C lower than the softening temperature of the compound being modified in cured state in amount of 30-185 wt parts of the compound. EFFECT: more efficient, modification process. 1 tbl
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Authors
Dates
1996-04-10—Published
1990-12-12—Filed