FIELD: adhesive materials.
SUBSTANCE: invention relates to an epoxy composition for producing elastic adhesives and gluing solid materials based on epoxy resin with improved adhesion, strength and elastic properties and can be used as adhesives (glues) for gluing various solid and/or flexible materials to each other. Disclosed is an epoxy composition for hot-curing adhesive, potting, sealing and repair compositions, consisting of epoxy resin and an anhydride curing agent, which additionally contains a co-curing agent-modifier—copolymer of alpha-olefins C8 and maleic anhydride, characterized by molecular weight 10,000 Da, at following ratio of components, wt.%: anhydride curing agent—20–50; copolymer of C8 alpha-olefins and maleic anhydride—10–40 and low-viscosity epoxy resin—the rest.
EFFECT: achieving optical transparency of cured samples with high adhesion strength and elasticity, which makes it possible to use this system, for example, as an adhesive for optical devices, compositions for self-leveling floors; possibility of epoxy composition operation under conditions of wide temperature range from −50 to +130 °C.
3 cl, 1 dwg, 1 tbl, 6 ex
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Authors
Dates
2024-10-07—Published
2023-12-25—Filed