FIELD: metallurgy.
SUBSTANCE: invention relates to the method for production of a heat resistant compound for sealing of electric radio engineering products. The compound contains an epoxide resin, a titanium-silicon-organic oligomer, a TMPT product, methyl tetrahydrophthalic or isomethyl tetrahydrophthalic anhydride, ground talc, ground dusty quartz and aluminium oxide. Epoxide resin and titanium-silicon-organic oligomer, the TMPT product, is heated. Talc, ground quartz and aluminium oxide are mixed in a ball mill for production of a homogeneous mass, then dried, introduced into a mixture of epoxide resin with titanium-silicon-organic oligomer, the TMPT product, and mixed. The mixture is cooled, and methyl tetrahydrophthalic or isomethyl tetrahydrophthalic anhydride melted at the same temperature is introduced into it. The compound is thoroughly mixed and vacuumised until active release of bubbles tops. After soaking in water, the compound is hardened in a thermal cabinet, then cooled with a thermal cabinet.
EFFECT: compound has increased mechanical tensile strength, increased specific impact viscosity, higher electric strength and specific volume resistance in an initial condition.
2 tbl
Title | Year | Author | Number |
---|---|---|---|
COMPOUND AND A METHOD FOR PREPARATION THEREOF | 2005 |
|
RU2291176C1 |
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RU2532556C2 |
COMPOUND AND METHOD OF IT'S PRODUCTION | 2011 |
|
RU2474599C2 |
0 |
|
SU535330A1 | |
COMPOUND FOR SEALING ELECTRO-RADIOTECHNICAL ARTICLES AND METHOD OF PRODUCING SAID COMPOUND | 2010 |
|
RU2439117C1 |
ELECTRICAL EMBEDMENT COMPOUND | 2008 |
|
RU2356116C1 |
POLYMER COMPOSITION | 2002 |
|
RU2222558C1 |
POLYMERIC COMPOSITION | 2004 |
|
RU2264428C1 |
COMPOSITION FOR COMPOUND | 1993 |
|
RU2064956C1 |
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|
RU2194067C2 |
Authors
Dates
2012-11-27—Published
2011-05-10—Filed