FIELD: organosilicon compounds; heat shielding. SUBSTANCE: 2-10% solution or aqueous emulsion containing per 1 wt part of polymethylsiloxane oligomer, having general formula with 1-3 silanol groups and wherein CH3/Si= 1.66, 0.02-1.00 wt parts of metal-containing organosilicon compound of general formula [RSiMeO-]n wherein R is methyl or phenyl, Me is Fe or combination of Cu and Ce, and n=20-2000, is applied by means of brush on the surface of a porous heat-shielding quartz fiber-based material. The material is left to stand in the air for 60-70 min and thereafter is thermally treated at 200-400 C for 1.5-2 h to obtain heat-shielding member. EFFECT: improved heat-shielding characteristics. 2 tbl
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Authors
Dates
1996-11-10—Published
1983-10-19—Filed