FIELD: infrared electronic engineering; cooling of photosensing elements and their joining to optical, mechanical, and electrical hardware systems; cryogenic engineering. SUBSTANCE: device is accommodated in case with optical windows and has optoelectronic elements, hybrid-strip mounts providing heat insulation from case, flexible heat conductors, and heat insulators. Bases of hybrid strips of optoelectronic elements are shaped as parallelopipeds with channels receiving electric conductors and slots accommodating flexible heat conductors; they are mounted on baseplate and form C-shaped planar-contact circuits and are placed on either side of cooling system heat conductor well. Heat sink has flange joined with case through sealed bellows built up of alternating end disks and thin-walled coaxial tubes with shielding-vacuum heat insulation inbetween; it also has flat external edges with sections of flexible heat conductors fitted tightly to them through soft-material gaskets, as well as external cylindrical necks joined by means of clips to baseplate for displacement along and about well axis. Heat-insulating mount of baseplate is made in the form of disk joined with case by means of hold-down and puller screws and provided with sequentially joined closed frames inserted in each other in a spaced relation and filled with shielding-vacuum heat insulation. EFFECT: enlarged functional capabilities. 4 cl, 4 dwg
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Authors
Dates
1996-11-27—Published
1992-11-04—Filed