FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic engineering, particularly, to manufacturing of hybrid microcircuits, and can be used in production of hybrid photoelectric assemblies by means of micro-welding. In particular, in infrared photoelectronics there used are hybrid assemblies of photosensitive linear or matrix arrays arranged on one semiconductor substrate, which are electrically connected to integrated readout and preprocessing circuits (ICS ACS) arranged on other semiconductor substrates. Efficiency of the method consists in the emergence of the possibility of rotation of peripheral planes by a given angle, which, without reducing reliability of connections, enables to assemble all elements of hybrid photoelectric circuits on any assembly installation.
EFFECT: technical result is improved quality of assembly and reduced assembly time, technical result is simple design; besides, using this method allows to considerably increase labor productivity.
1 cl, 3 dwg
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