PRINTED-CIRCUIT BOARD MANUFACTURING PROCESS Russian patent published in 1997 - IPC

FIELD: electronic engineering. SUBSTANCE: surface of temporary metal substrate is sequentially covered with adhesive layer and foil. Circuit pattern is formed in foil by means of laser beam and circuit is transferred to permanent insulating base. Prior to do so, base surface is coated with adhesive compound according to circuit pattern. For the purpose, use is made of stamp or else base is covered with compound this being followed by its burning out from blanks of circuit by laser beam. EFFECT: facilitated procedure. 3 cl, 1 tbl