MANUFACTURING METHOD OF PRINTED-CIRCUIT BOARDS AND DEVICE FOR PRODUCTION OF CONDUCTING CIRCUIT Russian patent published in 2019 - IPC H05K3/00 

FIELD: physics.

SUBSTANCE: invention relates to radio engineering and specifically to methods of making printed circuit boards and devices for making a conductive circuit. Result is achieved by fact that preliminary manufacture of blank die with relief pattern of conductors on its surface. Male die has sharpened cutting edges in places of contact with a conducting layer on the dielectric substrate, formed with cutouts of various section, for example, triangular, semicircular or trapezoidal. Dielectric film and a layer of foil of conducting material are laid on a solid dielectric substrate. Assembled set of layers is fixed in press with installed male die. Male die is lowered with minimum pressure sufficient for sharp male die edges to penetrate and cut foil while gluing conductive pattern to dielectric substrate. As a result, the male die foil cut off by the puncheon is easily removed manually or by an adhesive roller, and only the conductive circuit pattern fixed with an adhesive material remains on the dielectric substrate.

EFFECT: technical result is fabrication of a conductive circuit on a substrate for use in printed circuit boards, which can be made without or without formation of chemical substances hazardous to the environment.

11 cl, 6 dwg