METHOD FOR MANUFACTURING OF MULTILAYER PRINTED CIRCUIT BOARD Russian patent published in 2012 - IPC H05K3/06 H05K3/08 H05K3/46 G06K19/77 

FIELD: electricity.

SUBSTANCE: method to manufacture a printed circuit board with a lead pattern includes the following stages: i) on a substrate (1) a conducting layer is attached selectively, for instance, a metal foil (3), so that a part of the specified conducting layer containing the specified sections (3a), forming conductors in the end item, and narrow sections (3c) arranged between the specified conducting sections of the end item, is fixed on the substrate (1) by means of a binder (2). At the same time larger conducting layer sections (3b) to be removed are substantially loose on the substrate and are connected with the substrate (1) by not more than their edge section to be processed at the next stage ii) and possibly sections preventing separation of sections to be removed prior to completion of the stage iii); ii) on the specified conducting layer a lead pattern is arranged by removal of the material, for instance, a metal foil (3), from narrow gaps between specified conducting sections (3a) and at the external periphery of the section (3b) removed in a solid condition; iii) conducting layer sections (3b) to be removed, which are loose on the substrate (1), are removed in a solid condition, since the specified sections (3b) to be removed, which have been previously connected with the substrate by their edge sections are not any longer retained by the edge sections of the conducting layer, which have been removed from the external periphery of the sections to be removed on the stage ii).

EFFECT: higher controllability and efficiency of a method to manufacture multilayer printed circuit boards, increased economic efficiency and reliability of a method to produce electric circuits placed along both sides of a substrate, permitting usage of a laser in production of printed circuit boards.

13 cl, 7 dwg