METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS Russian patent published in 2016 - IPC H05K3/22 

FIELD: radio engineering and electronics.

SUBSTANCE: invention relates to electronics and radio engineering and is intended for use in production of printed circuit boards and instruments. Proposed method of making printed-circuit boards on the time of the metal substrate using electroplated photolithography depositing top copper layer and layer of precision mounting transition contact elements. Then formed elements level with upper end of transient contact elements are applied electro-conductive thermoplastic material and plated by increasing the second switching layer. On completion of formation of all layers of the board melted thermoplastic material, and is placed into its place thermosetting dielectric, time is then separated metal substrate from finished printed circuit board.

EFFECT: simplified technology of manufacturing of printed circuit boards and reduced labor intensity, as well as reduced losses of metal.

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