METHOD OF MAKING PRINTED CIRCUIT BOARDS WITH BUILT-IN RESISTORS Russian patent published in 2010 - IPC H05K3/06 H05K3/10 

FIELD: physics.

SUBSTANCE: when making printed circuit boards, the insulating layer used is aluminium nitride. Built-in resistors are put into openings with deposition of an insulating layer of aluminium nitride on walls of the openings, and a current conducting layer is also deposited on the butt ends of the built-in resistors. The conductive pattern of the circuit is made through deposition of a photomask, galvanic reinforcement of the thickness of the conducting layer, deposition of a protective metal resist, removal of the photomask and etching the conducting layer from gaps, or the current conducting layer is galvanically reinforced first, a photomask is put into contact pads, conductors and location of the butt ends o the built-in resistors, the current conducting layer is etched from the gaps, the photomask is removed, a protective solder mask is put and the contact pads and walls of the mounting openings are serviced. The printed circuit boards with built-in resistors are checked for conformity with GOST 23752-79 Printed circuit boards. General specifications and stability of retaining resistance values for a long period of time under 10 times overloading conditions is checked.

EFFECT: increased thermal scattering power of resistors built into printed circuit boards, improved removal of heat from elements mounted on the printed circuit board.

3 cl, 1 dwg