METHOD OF FABRICATION OF NOT CATHODE FOR ELECTRONIC DEVICE AND COMPOSITION OF SOLDER FOR FABRICATION OF HOT CATHODE Russian patent published in 1997 - IPC

Abstract RU 2079922 C1

FIELD: electronic engineering. SUBSTANCE: porous sponge of refractory metal is joined to the body by soldering with the use of solder containing W, Co and Mo at a temperature of 1400 to 1450 C; prior to soldering, the sponge is prepressed to the solder. EFFECT: facilitated procedure. 2 cl, 3 tbl

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RU 2 079 922 C1

Authors

Mel'Nikova I.P.

Kozlov V.I.

Usanov D.A.

Dates

1997-05-20—Published

1994-08-09—Filed