SEMICONDUCTOR MODULE Russian patent published in 1997 - IPC

FIELD: semiconductor devices, in particular, semiconductor modules used in control systems of electric motors of industrial and domestic application and various supply systems of radio engineering articles. SUBSTANCE: semiconductor module comprises case filled with sealing compound based on resin having cover and base in the form of metal flange and insulating substrate put on it carrying soldered current leads, semiconductor elements placed on insulating substrate and connected to current leads. Flange has rectangular shape and cylindrical recesses located uniaxially along centers of opposite sides. Cover is made box-shaped with protrusions located in centers of side surfaces having cylindrical shape and engaging flange by matching protrusions width recesses in flange. Recesses and protrusions are bonded by adhesive compositions. Cylindrical recesses in flange are made in ratio 1: (27032) of radius to length of flange. Clearance between matching surfaces of protrusions on side surfaces of cover and recesses in flange engaging one another amounts 10-15% of radius of flange recess. Flange and cover are joined with usage of high-temperature compositions based on organic compounds. Cover is produced from water-resistant and mechanically strong plastic material. EFFECT: broadened application field. 5 cl, 2 dwg