METHOD OF PREPARING MOLDING EPOXY MATERIAL Russian patent published in 1997 - IPC

FIELD: manufacture of molding epoxy material intended for manufacturing components in electronic and ratio engineering industries. SUBSTANCE: epoxy component includes mixture of epoxy resins such as epoxy diane resin (A), dioxydiphenyl sulfone diglycidol ether (B) and tetrabromodiphenylolpropane (C) at A: B:C ratio from 90:5:5 to 5:50:45 and melt of epoxy resins (K) is mixed with aromatic amine (L) at K:L ratio from 85:15 to 98:2 at 50-70 C, and filler (M) is then added at resinous part (K+L):(M) form 50:5 to 20:80 and maintained for 5-10 hours, the crushed and rolled at 40-70 C for 5-10 minutes and 1-25 wt parts of aromatic amine, 0.4-20 wt parts of antiadhesive and 1-25 wt parts of dye stuff are then added. EFFECT: improved fluidity, higher hardening rate, non-combustibility of molded products and retention of dielectric properties. 4 tbl