FIELD: production of molded materials on the base of epoxy resins. SUBSTANCE: epoxy molded material comprises, wt.p.: prepolymer, 100; 4,4′-diaminodiphenyl methane, 10-20; anti-adhesive additive, 6-12; coloring additive, 0.2-1.0; glass fiber filler, 150-280. Prepolymer is prepared by interaction of epoxy diane resin (its molecular weight being 340-600) with 4,4′-diaminodiphenyl sulfone, phenol formaldehyde novolac and with p-aminobenzyl aniline at their mass ratio (70-90):(6-18):(2-8):(2-4), respectively. Components are mixed all together within 90 m and then are rolled. EFFECT: improved quality of product. 2 tbl
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Authors
Dates
1998-06-27—Published
1996-07-25—Filed