POLYMER SEALING COMPOUND Russian patent published in 2022 - IPC C09J163/02 C09K3/10 C08L63/00 H01B3/40 C08K5/17 C08K5/544 

FIELD: electrical engineering.

SUBSTANCE: invention relates to the field of electrical engineering, in particular to epoxy low-viscosity, aggressiveproof casting compounds. The polymer sealing compound can be used for electrical insulation and hardening by pouring, for sealing and protection from mechanical influences of electronic devices with tightly packed elements, in particular in-pipe inspection devices. The invention relates to a two-component polymer sealing compound containing epoxy-diane resin, diglycidyl ether of 1,4-butanediol and phenylglycidyl ether, with aromatic oligoamide of the ETAL type and diethylaminomethyltriethoxysilane used as an amine-type hardener.

EFFECT: reducing the initial viscosity of the sealing compound according to the invention makes it possible to be used for electrical insulation and hardening by pouring; the composition is resistant to aggressive environments, including environments with a high content of hydrogen sulfide.

3 cl, 7 tbl, 2 ex