FIELD: radio engineering. SUBSTANCE: method involves application of porous titan layer using cathode-ray evaporation of titan under continuous movement of base over evaporator at distance of 300- 400 mm and inclination angle of evaporated flow with respect to base 40-60 degrees, pressure in vacuum chamber is in range of 0.01- 5 Pa and condensation temperature is 300-500 C. Then layer of titan nitride is generated by means of titan evaporation in nitrogen or ammonium under pressure of 0.01-5 Pa or by means of cathode deposition of titan target under pressure of 0.01-1.0 Pa. Final product consists of aluminum base which is covered with sequence of titan and titan nitride layers. Titan layer has crystals and units of crystals. Depth of bulges and recesses is in range of 0.01-1.0 mm, integral titan porosity is in range of 25-50 %. Thickness of titan nitride layer is in range of 0.05-3.0 mcm, size of titan nitride grains is in range of 0.01-1.0 mcm. Depth of bulges and recesses is in range of 0.005-0.5 mcm. EFFECT: maximal area of contact to electrolyte, increased stability to corrosion, minimal electric resistance at cathode-electrolyte contact. 4 cl, 1 tbl, 4 dwg
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Authors
Dates
1997-12-10—Published
1996-04-03—Filed