EPOXY PUTTY Russian patent published in 1997 - IPC

FIELD: patching deep and shallow defects on various surfaces; bonding together surfaces operating in moisture- and oil-saturated media. SUBSTANCE: epoxy putty comprises, %: epoxy dianic resin, 27-40; dibutylphtalate, 2-6; aluminium fine-grain powder, 4.5-9.0; aluminium coarse-grain powder consisting of spherically or droplet-shaped grains, 36-53; aminophenols based on ethylene diamine derivatives or ethylene diamine adduct with epoxy oligomer, 6-9. Aluminium fine-grain powder is mixed with dibutylphtalate in dissolving vessel. Epoxy resin is charged into mixer provided with water jacket, followed by heating resin up to about 40 C. Next dibutylphtalate wetted with fine-grain aluminium powder and coarse-grain aluminium powder are added to heated epoxy resin, and resulting mixture is stirred for 30 min. to obtain homogeneous mass. Curing agent is added to putty just before its use. Putty thus-prepared has following properties: drying time at 20<$E+->2 C 5 h., strength of putty layer under blow 40 cm, strength of putty layer as it is broken away 800 n/sq. cm, elasticity as measured according to flexibility scale on layer 3 mm thick 20 mm, stability to effect of sign-variable temperatures 12 cycles, resistance to static effect of mineral oil at 20<$E+->2 C 60 days, stability to effect of PALMIRA paste detergent solution until whitening at 40<$E+->2 C for 4 h. EFFECT: handy and cheap putty for multiple uses. 2 tbl