MODULE METHOD FOR ASSEMBLING IMPLANT Russian patent published in 1998 - IPC

FIELD: medical engineering. SUBSTANCE: device has endosseous plate 1 and two removable heads 3 connected to the endosseous plate by pins 4 mounted on necks of removable heads 3 along the plane of endosseous plate in parallel relation to one another. Necks 5 are made from endosseous plate segments and have rest platforms 6 positioned in orthogonal relation to the plane of endosseous plate 1 and their diameter is selected to be greater than or equal to removable head diameter. The ends of each pin 4 are attached to rest platform 6 of the corresponding neck. A removable head is made from bushing 3 having longitudinal threaded hole so that ratio of diameter of pin 4 to the thickness of endosseous plate 1 is selected in the range of 1.1-3.1 and ratio of distance between longitudinal axes of the pins to their diameter is selected in the range of 3.0-9.0. EFFECT: several kinds of wound adhesion selectable; enhanced effectiveness in correcting longitudinal tooth axis; lower load on endosseous plate. 14 cl, 8 dwg