FIELD: manufacture of printed circuit boards by chemical etching. SUBSTANCE: method includes electrolytic deposition of copper on cathode with current density of 8-10 A/sq.dm and temperature of 20-40 C and oxidation of ferrous chloride to ferric chloride on anode. In so doing, additionally anolyte space is agitated by bubbling, and added continuously or periodically is hydrazine in the amount of 10-20 g/kg of etched copper and 20-50 g/100 l of etching solution for a day in standing. EFFECT: higher efficiency.
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