STRUCTURE SOLDERING METHOD Russian patent published in 1998 - IPC

FIELD: soldering welded structures with cavity between parts to be soldered. SUBSTANCE: method comprises steps of assembling structure for soldering, forming inner cavity between parts to be soldered, placing solder between said parts, sealing cavity by means of two welded seams on its ends, joining cavity with helium pickup of leakage finder, feeding to working space of furnace mixture of shield gases containing pressurized argon and helium (2.5%). Simultaneously inner cavity of structure is evacuated. Then assembled structure is heated in furnace up to temperature initiating solder melting and fluid tightness degree of cavity is tested. When fluid tightness degree is not sufficient helium pickup forms acoustic signal and pointer of indicator deviates. EFFECT: enhanced efficiency. 2 cl