PROCESS OF SOLDERING OF TELESCOPIC STRUCTURES Russian patent published in 1998 - IPC

FIELD: manufacture of telescopic structures having external and internal shells of heterogeneous materials. SUBSTANCE: multilayer structure having several internal sealed spaces is assembled for soldering and is soldered in furnace. Inert gas under excessive pressure in injected into furnace for compression of internal shells 2, 3. Space 5 bordering on extreme internal shell 3 is filled with gas under pressure. This pressure is counterpressure relative to external pressure in furnace and corresponds in value to difference between external pressure and maximum permissible pressure. Permissible pressure is determined by yield point of material of this shell under temperature of soldering. EFFECT: increased output of good production thanks to provision of good contact between soldered surfaces. 1 dwg