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2 129 482

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C1

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IPC

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Application

96117135/02, 1996-08-19

(22)

Actual filing date

1996-08-19

(45)

Published

1999-04-27

(72)

Inventor

Semenov V.N.

(73)

Holder

Nauchno-Proizvodstvennoe Ob"Edinenie Ehnergeticheskogo Mashinostroenija Im.Akad.V.P.Glushko

SOLDER FOR PARTS SOLDERING Russian patent published in 1999 - IPC

Abstract RU 2129482 C1

FIELD: solders for soldering of copper-steel structures. SUBSTANCE: solder contains the following components, wt.%: silver, 2.5-3.5; manganese, 9.5-12.5; nickel, 5.0-6.5; copper, the balance. EFFECT: higher thermal stability of soldered joints.

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RU 2 129 482 C1

Authors

Semenov V.N.

Dates

1999-04-27—Published

1996-08-19—Filed

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