PROCESS OF SOLDERING OF TELESCOPIC STRUCTURES Russian patent published in 1998 - IPC

FIELD: joining of shells of heterogeneous materials with use of high-temperature soldering. SUBSTANCE: telescopic structure composed of thin-walled internal and thick-walled external shells is assembled. External shell is welded from heterogeneous materials. Coefficient of thermal expansion of material of element 2 of external shell is less than that of its element 1. Thermal compensator 7 is mounted on internal side of internal shell 4. Additional thermal compensator 8 made from material which coefficient of thermal expansion is equal to thermal coefficient of element 2 of external shell is mounted on external shell. Soldering is executed in furnace in atmosphere of inert gas. In process of soldering additional thermal compensator 8 absorbs stretching forces in element 1 caused by weld and element 2 and does not exert any considerable action on element 1. EFFECT: increased output of good products thanks to enhanced tightness of soldered joints. 1 dwg