METHOD OF SOLDERING OF TELESCOPIC STRUCTURES Russian patent published in 1997 - IPC

FIELD: mechanical engineering; soldering of telescopic structures with thin-walled inner envelope and thick-walled outer envelope manufactures of different materials. SUBSTANCE: inner thin-walled envelope is made of heat conducting material, for instance, bronze, with weld, and outer envelope is manufactured of high strength alloy. After assembling, placing of copper-silver solder and evacuation of inner space to be hermetically sealed, structure is heated in furnace at a pressure of inert gas - argon equal to 0.2-0.3 kgf/cm² to 550-570 C at which ductility of weld in inner envelope reaches ductility of its main material. After 30-40 min holding, gas pressure is sharply of soldering and cooling. Soldering temperature is equal to 970 C. EFFECT: increased output owing to prevention of defects in zone of weld in inner envelope.