FIELD: medical and electrical industries. SUBSTANCE: solder comprises (wt %): 1-3 silicon; 2-16 palladium; and the platinum balance. Solder has lower melting temperature and assures higher strength of soldered joint. Standard of fineness and color identity of backing and soldered joint of final jewelry are retained. EFFECT: improved properties of the final jewelry. 1 dwg, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
| SOLDER FOR SOLDERING JEWELRY ALLOYS OF PALLADIUM, 850 POINTS FINE | 2005 |
|
RU2289497C1 |
| SOLDER FOR PALLADIUM AND ITS ALLOYS | 2006 |
|
RU2317881C1 |
| JEWELRY ALLOY BASED ON HALLMARK 585 GOLD | 1999 |
|
RU2170280C1 |
| PLATINUM-BASED ALLOY | 1995 |
|
RU2085606C1 |
| PALLADIUM-BASED WHITE ALLOY | 2003 |
|
RU2244762C1 |
| WHITE-GOLD ALLOY | 1998 |
|
RU2135618C1 |
| SOLDER FOR SOLDERING METALS AND STEELS | 0 |
|
SU1763133A1 |
| ALLOY BASED ON WHITE GOLD OF HALLMARK 585 | 1999 |
|
RU2156824C1 |
| SOLDER FOR SOLDERING JEWELS MADE FROM ALLOY OF 850-STANDARD PALLADIUM | 2010 |
|
RU2447170C1 |
