SOLDER FOR SOLDERING JEWELS MADE FROM ALLOY OF 850-STANDARD PALLADIUM Russian patent published in 2012 - IPC C22C5/04 B23K35/30 

Abstract RU 2447170 C1

FIELD: metallurgy.

SUBSTANCE: proposed solder contains the following components in wt %: palladium - 85.0-85.5, boron - 2.0-3.2, copper making the rest.

EFFECT: lower melting point, optimum hardness and strength.

2 tbl

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RU 2 447 170 C1

Authors

Sidel'Nikov Sergej Borisovich

Dovzhenko Nikolaj Nikolaevich

Beljaev Sergej Vladimirovich

Mal'Tsev Ehduard Vladimirovich

Biront Vitalij Semenovich

Uskov Igor' Vasil'Evich

Stoljarov Aleksandr Valentinovich

Lopatina Ekaterina Sergeevna

Rudnitskij Ehdvard Anatol'Evich

Lebedeva Ol'Ga Sergeevna

Dates

2012-04-10Published

2010-08-20Filed