FIELD: metallurgy of precious metals.
SUBSTANCE: invention relates to palladium-based solders designed for use in jewelry, mainly, when making articles of palladium 850 points fine alloys. Proposed solder for soldering jewelry alloys of palladium 850 points fine contains palladium, copper and silicon at the following ratio of components, mass %: palladium 85.0-85.5, copper 12.0-13.0, silicon 2.0-3.0. proposed solder features hardness commensurable with hardness of solded alloy and provides color identity in ready pieces of jewelry and good yield at provision of coincidence of fineness of solded alloy and solder.
EFFECT: provision of high strength and quality of soldered joint.
1 tbl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
SOLDER FOR PALLADIUM AND ITS ALLOYS | 2006 |
|
RU2317881C1 |
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PLATINUM BASED SOLDER FOR SOLDERING JEWELRY | 1997 |
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SOLDER ALLOY BASED ON PALLADIUM 850 ALLOY | 2014 |
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RU2568406C1 |
SOLDER FOR HIGH-TEMPERATURE SOLDERING | 1991 |
|
RU1793619C |
AMORPHOUS COPPER-BASED STRIP SOLDER | 2011 |
|
RU2464143C1 |
SOLDER FOR SOLDERING JEWELRY | 0 |
|
SU1593860A1 |
SOLDER ALLOY FOR SOLDERING POLYCRYSTALS OF SUPERHARD MATERIALS | 1991 |
|
RU2102207C1 |
Authors
Dates
2006-12-20—Published
2005-05-23—Filed