SOLDER FOR SOLDERING JEWELRY ALLOYS OF PALLADIUM, 850 POINTS FINE Russian patent published in 2006 - IPC B23K35/30 C22C5/04 

Abstract RU 2289497 C1

FIELD: metallurgy of precious metals.

SUBSTANCE: invention relates to palladium-based solders designed for use in jewelry, mainly, when making articles of palladium 850 points fine alloys. Proposed solder for soldering jewelry alloys of palladium 850 points fine contains palladium, copper and silicon at the following ratio of components, mass %: palladium 85.0-85.5, copper 12.0-13.0, silicon 2.0-3.0. proposed solder features hardness commensurable with hardness of solded alloy and provides color identity in ready pieces of jewelry and good yield at provision of coincidence of fineness of solded alloy and solder.

EFFECT: provision of high strength and quality of soldered joint.

1 tbl, 1 dwg

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RU 2 289 497 C1

Authors

Ermakov Aleksandr Vladimirovich

Grokhovskaja Lilija Georgievna

Kljueva Inessa Borisovna

Kuz'Menko Grigorij Fedorovich

Dates

2006-12-20Published

2005-05-23Filed