SOLDER FOR PALLADIUM AND ITS ALLOYS Russian patent published in 2001 - IPC

FIELD: metallurgy; precious metal-based soldering alloys. SUBSTANCE: invention relates to soldering palladium and its alloys and it designed for use in manufacture of jewellery. Invention provides coincidence of purity of base metal and soldered joint at preservation of their color identity in jewellery. Hardness of solder does not exceed hardness of soldered alloy. For this purpose solder includes zinc at the following ratio of components, mass %: palladium -50.0 - 50.5; solver 1.0- 45.0; copper 1.0-43.0; silicon 0.1-6.0; zinc - up to 3.0. Summary content of silver and copper does not exceed 49 mass %. EFFECT: improved quality of soldered joint. 1 tbl, 1 dwg