FIELD: precision instrument making, microelectronics, manufacture of optical and electronic elements, application of decorative patterns. SUBSTANCE: process includes transfer of material of donor film applied on substrate transparent to laser radiation to second substrate by heating of donor film with laser radiation through substrate, evaporation of material of second substrate from its surface by beam passed through donor film. Thickness of donor film is chosen in agreement with specified mass relation of materials of donor film and second substrate in mix of deposited film. EFFECT: expanded class of materials used in film application. 4 cl, 1 dwg
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Authors
Dates
1998-08-10—Published
1997-04-25—Filed